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Leadframe Material

Working behind the scenes to support information technology

Leadframes are processed metal products used in semiconductor package devices. Copper alloys have become the main material used in leadframes nowadays, as higher electrical conductivity and heat radiation are required. PCs and cellular phones are becoming smaller and have more functions, and electronics are increasingly used in automobiles.

Kobe Steel had an early start in developing high-performance and low-cost copper alloys. Our wide product range of leadframes has received high acclaim by our users.

ICs make up the heart of electronic devices, such as cellular phones, and home electric appliances, that abound in our lives. Much like a centipede, the many legs protruding from an IC are actually part of a leadframe. Under the plastic case of the IC device is the semiconductor chip. The leadframe securely holds the chip and properly conducts electrical signals.

Currently, Kobe Steel has the largest market share of leadframes in Asia, where demand is expected to grow, as well as in Japan.
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World-standard copper alloys
In 1976, Kobe Steel successfully mass-produced CDA72500, a copper alloy containing nickel and tin, using a hot rolling process. CAC92TM, another type of copper alloy with superior characteristics, was also developed. Used in LEDs, CAC92TM has become the standard alloy for leadframes for mini-transistors.

KFCTM (Kobe Ferrous Copper), commercialized in 1977, is a precipitation hardened copper alloy containing iron and phosphorus. The alloy has electrical characteristics similar to pure copper while maintaining high strength and heat resistance. KFCTM was a revolutionary product when it was first brought on the market. As the patent for the alloy has expired, other companies have released similar products. Approximately 5,000 metric tons of this alloy are produced each month throughout the world, of which Kobe Steel produces 2,000 metric tons and the rest is supplied by other companies.
Starting with KFCTM
KFCTM is the world standard for leadframe materials used in discrete devices (single-function semiconductor devices such as transistors). KLFTM-2, KLFTM-4, KLFTM-5, and KLFTM-7, developed for higher strength, are all derived from KFCTM.

However, the early stages of KFCTM's development were problematic. As production rose, defects piled up. The R&D people had their hands full, coping with quality improvement and dealing with complaints. Not only the R&D division, but also the manufacturing and marketing departments, pitched in to overcome mounting challenges.
Maintaining the top share
Reaching the limits of the test equipment, Kobe Steel decided to conduct trials on a regular production line, yielding excellent results. After further development, mass production, which had seemed to be impractical, was made possible by hot rolling the Corson alloy (Cu-Ni-Si). Kobe Steel was the first to achieve this breakthrough.

The efforts paid off. Kobe Steel, whose market share was seventh in 1976, has maintained the top share - 30% of the Asian market - since the 1990s.
Shifting production to Asia
Leadframes are the nerves of IC chips. As IC chips increase in performance and become smaller, better heat dissipation, improved strength, and higher precision are required, while production costs must be kept down. Accordingly, copper manufacturers are fiercely competing to develop new materials.

On the other hand, semiconductor manufacturers are shifting production to Asia to reduce costs. The market for leadframe materials is expected to further expand in Asia, especially China.
* KFC, KLF and CAC are trademarks of Kobe Steel , Ltd.
 
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