Sintering HIP Equipment

This equipment allows sintering and HIP treatment in a series of thermal cycles, which results in less energy loss compared with the case of processing with two independent equipment.

Sintering HIP Equipment

Typical Specifications

		Medium-Scale Equipment PSF5603	Large-Scale Equipment PSF7001
Main Specification	Pressure x Temperature	Vacuum X 1600°C 29.4MPa X 1600°C (300kgf/cm2)	Vacuum X 1600°C 9.8MPa X 1600°C (100kgf/cm2)
	Heater Configuration	2-Zone Graphite Heater	3-Zone Graphite Heater
	Material Dimensions	Φ300mm X 500mmL	Φ420mm X 1170mmL
Thermal Uniformity (°C)		Vacuum X 1450°C : 10°C or less 9.8MPa X 1600°C (100kgf/cm2) : 10°C or less	Vacuum X 1450°C : 10°C or less 9.8MPa X 1600°C (100kgf/cm2) : 10°C or less
Vacuum Evacuation System	Achieving Time	Within 15 Minutes At 0.133Pa	Within 15 Minutes At 0.133Pa
	Leak Rate	1.33 X 10-4Pam3/s or less	1.33 X 10-4Pam3/s or less

• Medium-and Large-Scale HIP Equipment
• Standard Small-Scale HIP Equipment
• Dr. Series
• Sintering HIP Equipment
• Ultra High Temperature / Ultra High Pressure HIP Equipment
• Other HIP Equipment
• Metal Capsule Manufacturing Equipment
• Compound Semiconductor Single Crystal Manufacturing Equipment