Testing and analysis of semiconductor and manufacturing equipment
Wafer Production
Front-end Process
Back-end Process
“Analysis/evaluation technologies x material knowledge” supports semiconductor-related R&D!
Testing and analysis
Materials and components
- Physical properties evaluation of materials (from thin film to bulk material)
- Electric properties, thermal properties, magnetic properties, mechanical strength, etc.
- Analysis of deterioration under special environments
- Corrosive gas, chemicals, exposure to hydrogen, high to low temperature, etc.
- Trial production of materials and material reformation
- Special alloy materials, three dimensional modeling materials, etc.
- Process study of systemic control
- Trial production of products related to recycling
- Materials informatics
- Prediction of physical properties by machine learning
Semiconductor manufacturing equipment
- Corrosion and deterioration analysis of metals, ceramics, and resin parts
- Simulation and reproduction test of deterioration caused by various gases, plasma, chemicals, etc.
- Analysis of corrosion and deterioration mechanisms (physical analysis)
- Durability test of various parts, pipes, containers, etc.
- Strength and fracture tests under various high pressure gas environments
- Strength and fracture tests in high and low temperature environments
- Equipment-related evaluation
- Sliding test (friction and abrasion) under various conditions, vibration analysis
- Visualization test on flow of gases and liquids
Wafers, thin films, and devices
- Evaluation of various wafers
- Ultra-trace element analysis / Cleanliness Evaluation of Environmental Air in Clean Room
- Crystal defects on surface, structural defects
- Measurement of wafer flatness, edge shape, etc.
- Evaluation of thin film physical properties and structure
- Crystal structure analysis and surface analysis
- High resolution analysis of thin films by HR-RBS
- Assessment of devices, implementing materials, etc.
- Assessment of bonding and strength
- *Fatigue strength of solder, bonding material, etc., and CAE collaboration
- Wide cross-section observation technique
- Failure analysis with OBIRCH, etc.
- Assessment of bonding and strength
Simulation technologies that support semiconductor development
Multi-scale simulation
Plasma simulation
Corrosion simulation in gas phase and liquid phase
Solution drying and dot formation analysis
Die Coating Simulation
Simulation of slurry drying and particle aggregation
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