Aluminum Components for Semiconductor Manufacturing Equipment
Front-end Process
Aluminum components supporting the advancement of semiconductor manufacturing equipment
In addition to high‑precision machining such as micro-hole drilling, thin‑wall machining, and mirror finishing, we provide integrated solutions covering joining and surface treatment processes.
Based on customer requirements, we offer total solutions for aluminum components for semiconductor manufacturing equipment.
Features
- The following high‑precision machining capabilities are available:
・Micro-hole drilling: Hole diameter ≤ φ0.5 mm with depth up to 30D
・Thin‑wall machining: Thin‑wall cylindrical machining with diameter ≥ φ500 mm and wall thickness ≤ t3 mm
・Mirror finishing: Mirror surface finishing with surface roughness Ra ≤ 0.05 - We also provide integrated support for joining processes such as diffusion bonding, FSW(Friction Stir Welding), and EBW(Electron Beam Welding), as well as surface treatments including anodizing.
Contact Us
You can reach us by clicking the inquiry button.