Technical Proposals for Processing Next-Generation Leadframes
Back-end Process
Precision machining of thick copper alloy plates and thermal stress control through structural analysis.
Application to SiC semiconductor leadframes
Required properties for power module leadframes
Structural proposals to mitigate issues caused by differences in coefficients of thermal expansion between copper leadframes and compound semiconductors(SiC)
Design proposals for next-generation leadframes using dual gauge high-conductivity copper alloys.
Application to SiC and GaN semiconductor leadframes
Required properties for advanced discrete packages
- Excellent electrical and thermal conductivity
- High reliability under harsh environments
- Customizable geometries for advanced packaging
Designs optimized for top-side cooling
- Extensive experience in flipped and SMD leadframe designs for top-side cooling
Seller: Singapore Kobelco Pte. Ltd.
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