High Strength and High Formability Copper Alloy CAC™ 60
High strength, Excellent stress relaxation resistance and Good bend formability
CDA No.64760
Features
- High strength exceeding 580MPa, suitable for use in small terminals
- Excellent bend formability compared to other Cu-Ni-Si alloys, providing greater flexibility in terminal and connector designs
- Excellent stress relaxation resistance. Applicable to SAE class 4
- Achiving 44% IACS in electrical conductivity, making it suitable for high-current cumponents
Applications
- Small terminals and connectors for automotive wire harness
- Special terminals for consumer and industrial use, etc.
Nominal Compositions
Cu-1.8Ni-0.4Si-1.1Zn-0.1Sn (mass%)
Characteristics
Physical Properties
| Specific Gravity | 8.9 |
|---|---|
| Coefficient of Thermal Expansion (293～573K) | 17.3 x 10 -6 /K |
| Thermal Conductivity (293K) | 197 W/m.K |
| Electrical Resistivity (293K) | 39.2 nΩ.m |
| Electrical Conductivity (293K) | 44 % IACS |
| Modulus Elasticity (293K) | 127 GPa |
- *Note: The above are typical characteristics.
Mechanical Properties
| Temper | Tensile Strength MPa |
Yield Strength MPa |
Elongation % |
Vickers Hardness MHv: 4.9N |
|---|---|---|---|---|
| H | 600–700 | 580 | 10 min | 180–220 |
| EH | 640–740 | 640 | 3 min | 190–230 |
- *Note 1: Figures in yield strength are nominal values.
- *Note 2: The above tensile strength and hardness are standard specifications. Technical specifications will be determined according to consumer requests.
90°V-Type Bend-Formability (MBR)
| Temper | Good Way | Bad Way |
|---|---|---|
| H | 0 | 0 |
| EH | 0.5 | 0.2 |
- *Note: The above are typical characteristics. The value slightly varies depending on the thickness of specimens.
Contact Us
You can reach us by clicking the inquiry button.