High Strength and High Conductivity Copper Alloy KLF™ 170
Achiving high electrical conductivity equivalent to C19400 and high strength equivalent to 42 alloy
CDA No.19170
KLF™ 170 is a a precipitation-hardened copper alloy a precipitation-hardened copper alloy with fine nickel-phosphorus intermetallic compounds in the matrix, formed by adding nickel and phosphorus to copper. This product achieves both high strength and high electrical conductivity by adjusting nickel and phosphorus contents.
Features
- High electrical and thermal conductivity, and higher electrical conductivity than C19400
- High electrical conductivity while achieving high strength comparable to Alloy 42 (Temper ESH)
- Free of smut contamination during pre-plating process and etching process
- Excellent stamping formability and etching formability
- Excellent bondability for gold and copper wires
- Excellent solderability and platability, while rducing the occurence of protrusions in the silver plating
Applications
- DIP/SIP leadframes
- Inner-frame for heat spreader etc.
Nominal Compositions
Cu-0.7Ni-0.13P-0.1Fe-0.1Zn (mass%)
Characteristics
Physical Properties
| Specific Gravity | 8.9 |
|---|---|
| Coefficient of Thermal Expansion (293～573K) | 17.5 x 10 -6 /K |
| Thermal Conductivity (293K) | 267 W/m.K |
| Electrical Resistivity (293K) | 26.5 nΩ.m |
| Electrical Conductivity (293K) | 65 %IACS |
| Modulus Elasticity (293K) | 110 GPa |
- *Note: The above are typical characteristics.
Mechanical Properties
| Temper | Tensile Strength MPa |
Elongation % |
Vickers Hardness MHv: 4.9N |
|---|---|---|---|
| SPH | 580–680 | 5 min | 170–210 |
| ESH | 610–730 | 5 min | 180–220 |
- *Note: The above tensile strength and hardness are standard specifications. Technical specifications will be determined according to consumer requests.
90°V-Type Bend-Formability (MBR)
| Temper | Good Way | Bad Way |
|---|---|---|
| SPH | 0 | 0 |
| ESH | 1.0 | 2.0 |
- *Note: The above are typical characteristics. The value slightly varies depending on the thickness of specimens.
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